Module Engineer – Wafer Packaging Manufacturing (WPM C4)

About the role

Join Intel’s Wafer Packaging Manufacturing (WPM) C4 team in Ireland as a Module Engineer. You will be responsible for ensuring high‑performance module operation in a highly automated fab, collaborating with technicians, engineers and global partners.

Key responsibilities

• Own module performance across safety, quality, output and equipment metrics.
• Sustain and optimise processes to guarantee stable, repeatable, high‑quality output.
• Use data and statistical methods to reduce variation and strengthen process control.
• Drive continuous‑improvement initiatives to enhance robustness and performance.
• Partner with 24/7 technician teams to rapidly contain and resolve issues.
• Lead structured problem‑solving across cross‑functional teams.
• Collaborate with the Virtual Factory network to align standards and deploy best practices.
• Support technology ramps, tool installations and high‑volume manufacturing transitions.
• Work with suppliers to improve tool capability and reliability.

Required profile

• Strong analytical and problem‑solving capability.
• Experience in manufacturing or technical environments.
• Ability to collaborate and influence across teams.
• Results‑driven mindset focused on consistency and continuous improvement.
• Semiconductor experience is an advantage.

Required skills

• Statistical analysis
• Process control
• Data‑driven decision making

What we offer

• Direct impact on product delivery and customer success.
• Quality‑focused culture with disciplined execution.
• Exposure to advanced wafer bumping and packaging technologies.
• Opportunities to own improvements and drive visible results.